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AMD Turion II Neo Dual-Core Mobile K665 - TMK665GAV23GM information

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Type:CPU Manufacturer:AMD
family:Turion II Neo Dual-Core Mobile microprocessors:AMD Turion II Neo Dual-Core Mobile K665 - TMK665GAV23GM
Type CPU / Microprocessor
Market segment Mobile
Family
AMD Turion II Neo Dual-Core Mobile
Model number    K645
CPU part number
  • TMK645GAV23GM is an OEM/tray microprocessor
Frequency    1600 MHz
Bus speed    One 1600 MHz 16-bit HyperTransport link (3.2 GT/s)
Clock multiplier    8
Package 812-ball ASB2 BGA
Socket BGA812
Size 1.06" x 1.06" / 2.7cm x 2.7cm
Introduction date Jan 4, 2011
End-of-Life date Last order date is end of 3rd quarter 2011
Last shipment date is end of 1st quarter 2012
Architecture / Microarchitecture
Microarchitecture K10
Platform Nile
Processor core    Geneva
Core stepping    DA-C3
CPUID 100F63
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Data width 64 bit
The number of cores 2
The number of threads 2
Floating Point Unit Integrated, 128-bit wide
Level 1 cache size    2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size    2 x 1 MB 16-way set associative caches
Level 3 cache size None
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • Extensions to MMX
  • 3DNow! technology
  • Extensions to 3DNow!
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSE4a   
  • AMD64 / AMD 64-bit technology   
  • EVP / Enhanced Virus Protection   
  • AMD-V / AMD Virtualization technology
Low power features PowerNow!
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3L-800
Maximum memory bandwidth (GB/s): 12.8
Other peripherals HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power    15 Watt


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